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Dixon Technologies Sets Ambitious Targets with AI Hardware Expansion and Strategic Joint Ventures

AI News

Dixon Technologies Sets Ambitious Targets with AI Hardware Expansion and Strategic Joint Ventures

Dixon Technologies expects 60 million smartphone volumes in FY28, says CFO Saurav Gupta

CNBC-TV18

Dixon Technologies expects 60 million smartphone volumes in FY28, says CFO Saurav Gupta

Saurabh Gupta, Director & Group CFO, Dixon Technologies said that the company is also exploring opportunities in silicon photonics-based optical transceivers and advanced packaging for AI data...

Dixon maps AI hardware expansion through Inventec, Gemtek, prospective packaging partners

DIGITIMES

Dixon maps AI hardware expansion through Inventec, Gemtek, prospective packaging partners

Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing, although its...

Dixon turns to joint ventures, components as price-led growth leaves margins thin

DIGITIMES

Dixon turns to joint ventures, components as price-led growth leaves margins thin

Dixon Technologies is counting on smartphone joint ventures, expanding IT hardware production, and locally made components to turn a sharp sales increase into stronger earnings, as rising memory...

Dixon Tech shares: Why stock rallied 11% after Q2; CLSA, JPMorgan targets

Business Today

Dixon Tech shares: Why stock rallied 11% after Q2; CLSA, JPMorgan targets

Dixon Tech: JPMorgan suggested a 'Buy' rating with a target of Rs 16,800 on Dixon Tech. UBS also has a 'Buy' rating with a target of Rs 15,600. Investec retained its 'Buy' rating with a target of...

Dixon Technologies Eyes Silicon Photonics And Advanced Chip Packaging To Enter AI Infrastructure Market

NEWS18

Dixon Technologies Eyes Silicon Photonics And Advanced Chip Packaging To Enter AI Infrastructure Market

The Indian electronics manufacturer is evaluating partnerships and acquisitions that could help it build capabilities in high-speed optical transceivers and advanced packaging.

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