Nvidia's Next-Gen Memory Chips Propel Samsung to TSMC's 3nm Technology

10/19/2026

Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung...

10/18/2026

Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.

10/18/2026

Samsung Electronics will use TSMC's 3-nanometre process to produce base dies ​for Nvidia's next-generation custom high-bandwidth memory (HBM) ‌chips, the Seoul Economic Daily reported on Sunday.

10/17/2026

Japan's Ministry of Economy, Trade and Industry (METI) on Oct. 16 approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3-nanometer logic chips at its second fab in...