Samsung and TSMC Join Forces to Develop Next-Gen Memory Chips for Nvidia

10/19/2026

Samsung is reportedly adopting TSMC’s 3nm process for Nvidia’s next-generation HBM base dies, marking a potential shift in its memory chip manufacturing strategy.

10/19/2026

Samsung is reportedly collaborating with the world's largest chip maker, TSMC, to secure a base die supply for NVIDIA's newly announced NVHBM memory standard. NVHBM integrates the controller into...

10/18/2026

Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.

10/18/2026

Samsung Electronics will use TSMC's 3-nanometre process to produce base dies ​for Nvidia's next-generation custom high-bandwidth memory (HBM) ‌chips, the Seoul Economic Daily reported on Sunday.

10/18/2026

Samsung will reportedly use TSMC's 3-nanometre process for Nvidia's custom HBM base dies, marking its first collaboration with the Taiwanese firm at the HBM manufacturing stage