Samsung and TSMC Team Up to Develop Nvidia's Next-Gen HBM Chips on 3nm Process

10/19/2026

Samsung Electronics is working with TSMC to use its 3nm process for producing base dies in Nvidia’s next generation of custom HBM chips.

10/19/2026

Samsung is reportedly set to utilize TSMC's 3nm process for manufacturing Nvidia's next-generation high-bandwidth memory base dies, indicating a strategic shift.

10/19/2026

Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung...

10/18/2026

Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.

10/18/2026

Samsung will reportedly use TSMC's 3-nanometre process for Nvidia's custom HBM base dies, marking its first collaboration with the Taiwanese firm at the HBM manufacturing stage

10/18/2026

Samsung Electronics will use TSMC's 3-nanometre process to produce base dies ​for Nvidia's next-generation custom high-bandwidth memory (HBM) ‌chips, the Seoul Economic Daily reported on Sunday.

10/18/2026

Samsung has typically adopted a "turnkey" approach when developing HBM’s core and base dies, but according to the latest report, NVIDIA’s custom NVHBM requires a more streamlined approach in...