Samsung and TSMC Unite to Power Nvidia's Next-Gen HBM Chips with 3nm Technology

10/19/2026

Samsung is reportedly set to utilize TSMC's 3nm process for manufacturing Nvidia's next-generation high-bandwidth memory base dies, indicating a strategic shift.

10/19/2026

Samsung Electronics is working with TSMC to use its 3nm process for producing base dies in Nvidia’s next generation of custom HBM chips.

10/19/2026

Samsung Electronics will make a core part of Nvidia’s custom memory chips on TSMC’s 3-nanometre process. The Seoul Economic Daily reported the move on Sunday, citing industry sources. It would be...

10/19/2026

Samsung is reportedly collaborating with the world's largest chip maker, TSMC, to secure a base die supply for NVIDIA's newly announced NVHBM memory standard. NVHBM integrates the controller into...

10/18/2026

Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.

10/18/2026

Samsung will reportedly use TSMC's 3-nanometre process for Nvidia's custom HBM base dies, marking its first collaboration with the Taiwanese firm at the HBM manufacturing stage

10/18/2026

Samsung Electronics will use TSMC's 3-nanometre process to produce base dies ​for Nvidia's next-generation custom high-bandwidth memory (HBM) ‌chips, the Seoul Economic Daily reported on Sunday.

10/18/2026

Samsung has typically adopted a "turnkey" approach when developing HBM’s core and base dies, but according to the latest report, NVIDIA’s custom NVHBM requires a more streamlined approach in...